Recent Advances in Thermal Interface Materials

R ecent Advances in Thermal Interface Materials Recent evolution of compactability and integration has become a revolution in electronic device development trends. The quantity of heat created by electrical equipment is steadily growing as their power grows. When two solid surfaces are linked, only a small fraction of the visible surface area will have an actual contact due to roughness in morphology. Modern electrical gadgets are distinguished by high power and frequency, as well as significant heat accumulation. As a result, Thermal Interface Materials (TIM) are put between two mating surfaces to promote thermal conductance across the interface. Thermal interface materials (TIMs) are critical for efficient heat dissipation to maintain good device functionality and longevity. As the power of electronic devices continues to grow, so does the amount of heat produced. Thermal interface material (TIM) may effectively increase heat transmission between two solid interfaces and is critical ...